FPT Group's Semiconductor Chip Testing and Packaging Factory in Bac Ninh has just officially entered phase 1 trial operation with 6 lines and a maximum design capacity of 300 million chips per year. This is considered a new link in Vietnam's efforts to master core technology.

1,600 m² factory in Yen Phong II-C Industrial Park

The factory is named FPT Analysis Technologies Joint Stock Company, has an area of ​​1,600 m² and is located in Yen Phong II-C Industrial Park, Bac Ninh province. During the testing phase, the factory can process a maximum of 300 million chips per year, enough to meet the large-volume testing needs of semiconductor businesses.

The establishment of the factory is in the direction of developing chip testing capacity in Vietnam, promoting the integration of the semiconductor value chain and realizing the goal of mastering core technology according to Resolution 57-NQ/TW, Decision 1131/QD-TTg and Decision 1018/QD-TTg.

Regarding standards, the factory operates according to international management standards including ISO 9001 for quality, ISO 14001 for environment and ISO 45001 for occupational safety and health. The clean room environment is controlled according to ISO 14644, with anti-static discharge measures and reliability testing methods suitable for each product line.

ATE Tester and Handler system in Class 10,000 clean room

FPT's testing line uses the ATE Tester automatic testing machine in combination with the Handler device. ATE Tester is responsible for testing the function and evaluating the chip's performance, while the Handler puts the chip into the test position and then classifies it according to pass or fail results. The entire testing area is located in a Class 10,000 (ISO Class 7) clean room to control dust and environmental factors.

Each chip line has its own functions and technical requirements, so the FPT engineering team must develop their own corresponding testing program, from determining the elements that need to be tested, setting up testing conditions to evaluating the results. FPT is also researching an AI application platform to automate this process, including data standardization, technical requirements, test configuration design and results evaluation.

Besides functional testing, the factory also evaluates product durability and reliability. Engineers operate chips in high-temperature environments, continuously changing temperatures or being affected by temperature and humidity simultaneously to detect the risk of damage early. Static control measures are also implemented to limit the risk of people or equipment coming into contact with components.

First order from Korean partner

In the first phase, the factory focuses on testing the functionality, quality and reliability of chips, aiming to serve domestic and international semiconductor enterprises. The first testing order is expected to come from a Korean partner, marking the beginning of FPT's chip testing service provision. In the near future, the reliability testing area will be developed according to international standards for testing and calibration laboratory capabilities to meet customer requirements.

The team has experts who have worked at Intel Vietnam

To operate the factory, FPT built a team of engineers with extensive experience in chip testing and packaging, including experts who have worked for many years at the Intel Vietnam factory. They are responsible for building technical processes, operating equipment and training personnel.

FPT also plans to utilize the factory for practical training. Right from the early stages, the factory coordinated with FPT Polytechnic College to build a pilot program so that students can access the chip testing line from December 2026, get acquainted with the equipment and actual working process.

Towards chip packaging technology

In the next steps, FPT plans to expand its in-depth testing capacity and develop chip packaging technology, while promoting the attraction of experts and cooperation with universities. With more than 10 years of experience in the semiconductor field, the group aims to build a chip packaging and testing ecosystem, thereby bringing Vietnam deeper into the global semiconductor value chain, in accordance with Resolution 57-NQ/TW and the Vietnam Semiconductor Industry Development Strategy to 2030, vision to 2050.